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詳細介紹
10w紅外皮秒光纖激光器GS-PIR10系列(MiniLED) 型號： GS-PIR10系列 脈寬（ps)： 15 功率： 10w 應(yīng)用： MiniLED、硅、碳化硅等脆性材料切割
10w紅外皮秒光纖激光器GS-PIR10系列(MiniLED)
10w Infrared Picosecond Fiber Laser GS-PIR10 Series
應(yīng)用優(yōu)勢：單/雙頭輸出、晶圓I R良率高、12um窄切割道
Advantages:
Single/Double head output,
LED wafer dicing, High I R yield,
12um narrow street width
技術(shù)指標(biāo)：<15皮秒, 10瓦, 50kHz-200kHz
Specifications:<15ps, 10w, 50KHz-200KHz
主要應(yīng)用：Mini-LED、硅、碳化硅等脆性材料切割
Applications: Mini-LED Saphire, Si, Sic and so on brittle materail cutting
Mini LED劃片
Wafer dicing/LED sapphire dicin
參數(shù) Parameters | 單位 Unit | GS-PIR10D |
工作模式 (Working Mode) | 脈沖 (Pulse) | |
中心波長 (Center Wavelength) | nm | 1027-1040 |
輸出功率 (Max Optical Average Power) | W | 10 |
典型輸出功率 (Typical Output Power) | W | 10@100KHz |
脈沖寬度 (Pulse Width) | ps | <15 |
輸出脈沖個數(shù) (Pulse Number) | 1-10 | |
重復(fù)頻率 (Pulse Repetition Rate) | KHz | 50-200 |
偏振 (Polarization) | 線偏 (linear) | |
消光比 (Extinction Ratio) | dB | ＞ 20 |
脈沖串能量 (Max Pulse train Energy) | uJ | 30 |
光束質(zhì)量M2(Beam Quality M2) | ≤1.2 | |
輸出光斑直徑 (Collimated Beam Diameter) | mm | 1.±0.3 |
輸出光功率可調(diào)范圍 (Output Power Tunability) | % | 0-100 |
功率穩(wěn)定度 (Power Consumption) | % | <1 |
傳遞光纖長度 (Delivering Fiber Length) | m | 1 |
工作環(huán)境 Working Conditions | ||
功率消耗 (Power Consumption) | W | 240 |
工作電壓 (Electrical Supply Voltage) | VDC | 24 |
工作溫度 (Operating Temperature) | °C | 20to30 |
存儲溫度 (Storage Temperature) | °C | 0to50 |
體積 (Dimensions)(LxWxH) | mm | 612x430x223 |
重量 (Weight) | kg | 45 |
*本產(chǎn)品可以根據(jù)客戶要求定制* Above specifications can be customizedfor your specific application.
機械結(jié)構(gòu)MechanicalDimensions
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